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diagonal 8mm (type 1/2) frame readout ccd image sensor with square pixel for color cameras description the ICX224AKF is a diagonal 8mm (type 1/2) interline ccd solid-state image sensor with a square pixel array and 2.02m effective pixels. frame readout allows all pixels' signals to be output independently within approximately 1/7.5 second. also, the adoption of high frame rate readout mode supports 30 frames per second which is four times the speed in frame readout mode. this chip features an electronic shutter with variable charge-storage time. adoption of a design specially suited for frame readout ensures a saturation signal level equivalent to when using field readout. ye, cy, mg, g complementary color mosaic filters are used as the color filters, and at the same time high sensitivity and low dark current are achieved through the adoption of super had ccd technology. this chip is suitable for applications such as electronic still cameras, pc input cameras, etc. features supports frame readout high horizontal and vertical resolution supports high frame rate readout mode: 30 frames/s square pixel horizontal drive frequency: 18mhz no voltage adjustments (reset gate and substrate bias are not adjusted.) ye, cy, mg, g complementary color mosaic filters on chip high sensitivity, low smear continuous variable-speed shutter low dark current, excellent anti-blooming characteristics 20-pin high-precision plastic package (top/bottom dual surface reference possible) device structure interline ccd image sensor image size: diagonal 8mm (type 1/2) total number of pixels: 1688 (h) 1248 (v) approx. 2.11m pixels number of effective pixels: 1636 (h) 1236 (v) approx. 2.02m pixels number of active pixels: 1620 (h) 1220 (v) approx. 1.98m pixels chip size: 7.6mm (h) 6.2mm (v) unit cell size: 3.9m (h) 3.9m (v) optical black: horizontal (h) direction: front 4 pixels, rear 48 pixels vertical (v) direction: front 10 pixels, rear 2 pixels number of dummy bits: horizontal 28 vertical 1 (even fields only) substrate material: silicon ?1 e98x33e22-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. ICX224AKF 20 pin sop (plastic) ? super had ccd is a registered trademark of sony corporation. super had ccd is a ccd that drastically improves sensitivity by in troducing newly developed semiconductor technology by sony corporation into sony's high-performance had (hole-accumulation diode) sensor aaaaa a aaa a a aaa a a aaa a aaaaa pin 1 v 4 48 2 10 pin 11 h optical black position (top view)
2 ICX224AKF note) : photo sensor v out gnd nc gnd v 1b v 1a v 2 v 3b v 3a v 4 v dd rg h 2 h 1 gnd sub c sub v l h 1 h 2 cy mg cy mg cy mg horizontal register vertical register note) 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 17 18 19 20 cy mg cy mg cy mg ye g ye g ye g ye g ye g ye g block diagram and pin configuration (top view) pin description ? 1 dc bias is generated within the ccd, so that this pin should be grounded externally through a capacitance of 0.1f. pin no. symbol description pin no. symbol description 1 2 3 4 5 6 7 8 9 10 v 4 v 3a v 3b v 2 v 1a v 1b gnd nc gnd v out vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock gnd gnd signal output 11 12 13 14 15 16 17 18 19 20 v dd rg h 2 h 1 gnd sub c sub v l h 1 h 2 supply voltage reset gate clock horizontal register transfer clock horizontal register transfer clock gnd substrate clock substrate bias ? 1 protective transistor bias horizontal register transfer clock horizontal register transfer clock
3 ICX224AKF absolute maximum ratings 40 to +12 50 to +15 50 to +0.3 40 to +0.3 25 to 0.3 to +22 10 to +18 10 to +6.5 0.3 to +28 0.3 to +15 to +15 6.5 to +6.5 10 to +16 30 to +80 10 to +60 10 to +75 v v v v v v v v v v v v v c c c v dd , v out , rg sub v 1a , v 1b , v 3a , v 3b sub v 2 , v 4 , v l sub h 1 , h 2 , gnd sub c sub sub v dd , v out , rg, c sub gnd v 1a , v 1b , v 2 , v 3a , v 3b , v 4 gnd h 1 , h 2 gnd v 1a , v 1b , v 3a , v 3b v l v 2 , v 4 , h 1 , h 2 , gnd v l voltage difference between vertical clock input pins h 1 h 2 h 1 , h 2 v 4 item ratings unit remarks ? 2 +24v (max.) when clock width < 10s, clock duty factor < 0.1%. +16v (max.) is guaranteed for turning on or off power supply. ? 2 against sub against gnd against v l between input clock pins storage temperature guaranteed temperature of performance operating temperature
4 ICX224AKF clock voltage conditions item readout clock voltage v vt v vh1 , v vh2 v vh3 , v vh4 v vl1 , v vl2 , v vl3 , v vl4 v v v vh3 v vh v vh4 v vh v vhh v vhl v vlh v vll v h v hl v cr v rg v rglh v rgll v rgl v rglm v sub 14.55 0.05 0.2 8.0 6.8 0.25 0.25 4.75 0.05 0.5 3.0 21.5 15.0 0 0 7.5 7.5 5.0 0 1.65 3.3 22.5 15.45 0.05 0.05 7.0 8.05 0.1 0.1 1.4 1.3 1.4 0.8 5.25 0.05 5.25 0.4 0.5 23.5 v v v v v v v v v v v v v v v v v v 1 2 2 2 2 2 2 2 2 2 2 3 3 3 4 4 4 5 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v v = v vh n v vl n (n = 1 to 4) high-level coupling high-level coupling low-level coupling low-level coupling cross-point voltage low-level coupling low-level coupling horizontal transfer clock voltage reset gate clock voltage substrate clock voltage vertical transfer clock voltage symbol min. typ. max. unit remarks bias conditions item supply voltage protective transistor bias substrate clock reset gate clock v dd v l sub rg 14.55 15.0 ? 1 ? 2 ? 2 15.45 v symbol min. typ. max. unit remarks dc characteristics item supply current i dd 4.0 7.0 10.0 ma symbol min. typ. max. unit remarks ? 1 v l setting is the v vl voltage of the vertical transfer clock waveform, or the same voltage as the v l power supply for the v driver should be used. ? 2 do not apply a dc bias to the substrate clock and reset gate clock pins, because a dc bias is generated within the ccd. waveform diagram
5 ICX224AKF clock equivalent circuit constant item capacitance between vertical transfer clock and gnd c v1a , c v3a c v1b , c v3b c v2 , c v4 c v1a2 , c v3a4 c v1b2 , c v3b4 c v23a , c v41a c v23b , c v41b c v1a3a c v1b3b c v1a3b , c v1b3a c v24 c v1a1b , c v3a3b c h1 c h2 c hh c rg c sub r 1a , r 3a r 1b , r 3b r 2 , r 4 r gnd r h 390 1800 1800 220 470 120 330 120 120 270 330 180 120 120 30 8 820 75 100 120 30 5 pf pf pf pf pf pf pf pf pf pf pf pf pf pf pf pf pf ? ? ? ? ? capacitance between vertical transfer clocks capacitance between horizontal transfer clock and gnd capacitance between horizontal transfer clocks capacitance between reset gate clock and gnd capacitance between substrate clock and gnd vertical transfer clock series resistor vertical transfer clock ground resistor horizontal transfer clock series resistor symbol min. typ. max. unit remarks r gnd c v1b3b r 1b c v41b v 1b c v4 c v41a c v1b c v1b3a c v1a1b c v1a c v1b2 r 1a v 1a c v1a2 v 2 r 2 c v24 c v1a3a c v23a c v23b r 3a v 3a c v2 c v3a c v3a3b c v1a3b c v3b r 3b v 3b c v3a4 c v3b4 v 4 r 4 vertical transfer clock equivalent circuit h 1 r h c h1 c h2 r h c hh h 2 r h h 1 h 2 r h horizontal transfer clock equivalent circuit
6 ICX224AKF drive clock waveform conditions (1) readout clock waveform (2) vertical transfer clock waveform ii 100% 90% 10% 0% tr twh tf m 0v m 2 v 1a , v 1b v 3a , v 3b v 2 v 4 v vhh v vh v vhl v vhh v vhl v vh1 v vl1 v vlh v vll v vl v vhh v vh3 v vhl v vh v vhh v vhl v vl3 v vl v vll v vlh v vhh v vhh v vh v vhl v vhl v vh2 v vlh v vl2 v vll v vl v vhh v vhh v vhl v vh4 v vhl v vh v vl v vlh v vll v vl4 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v v = v vh n v vl n (n = 1 to 4) ii v vt
7 ICX224AKF twh tf tr 90% 10% v hl twl h 1 two h 2 v rgl v rgll v rglh twl v rgh rg waveform v rglm tr twh tf v cr (3) horizontal transfer clock waveform (4) reset gate clock waveform v h v h 2 point a v rg v rglh is the maximum value and v rgll is the minimum value of the coupling waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll )/2 assuming v rgh is the minimum value during the interval twh, then: v rg = v rgh v rgl negative overshoot level during the falling edge of rg is v rglm . (5) substrate clock waveform v sub 90% 100% 10% 0% tr twh tf m m 2 (a bias generated within the ccd) v sub cross-point voltage for the h 1 rising side of the horizontal transfer clocks h 1 and h 2 waveforms is v cr . the overlap period for twh and twl of horizontal transfer clocks h 1 and h 2 is two.
8 ICX224AKF clock switching characteristics (horizontal drive frequency: 18mhz) item readout clock vertical transfer clock reset gate clock substrate clock v t v 1a , v 1b , v 2 , v 3a , v 3b , v 4 h 1 h 2 h 1 h 2 rg sub 1.36 14 14 7 1.7 1.56 19.5 19.5 5.56 10 3.6 14 14 19.5 19.5 5.56 37 0.5 8.5 8.5 0.01 0.01 4 14 14 0.5 15 0.5 8.5 8.5 0.01 0.01 5 250 14 14 0.5 s ns ns s ns s during readout when using cxd1267an tf tr 2ns during drain charge symbol twh min. typ. max. horizontal transfer clock h 1 , h 2 12 19.5 ns item symbol two unit remarks min. typ. max. min. typ. max. min. typ. max. min. typ. max. twl tr tf unit remarks horizontal transfer clock during imaging during parallel-serial conversion wave length [nm] relative response 400 450 500 550 600 650 700 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 cy g ye mg spectral sensitivity characteristics (excludes lens characteristics and light source characteristics)
9 ICX224AKF zone definition of video signal shading 8 8 8 8 1636 (h) v 10 h 8 h 8 v 10 zone 0, i zone ii , ii ' ignored region effective pixel region 1236 (v) measurement system ccd c.d.s s/h amp ccd signal output [ ? a] g/ye channel signal output [ ? b] s/h mg/cy channel signal output [ ? c] note) adjust the amplifier gain so that the gain between [ ? a] and [ ? b], and between [ ? a] and [ ? c] equals 1. image sensor characteristics (ta = 25 c) item sensitivity sensitivity comparison saturation signal smear video signal shading dark signal dark signal shading lag s r mgg r yecy vsat sm sh vdt ? vdt lag 280 0.75 1.15 500 350 0.001 0.004 1.17 1.48 0.0025 0.01 20 25 8 4 0.5 mv mv % % mv mv % 1 2 3 4 5 6 7 8 1/30s accumulation ta = 60 c frame readout mode, ? 1 high frame rate readout mode zone 0 and zone 0 to ? ' ta = 60 c, 7.5frame/s ta = 60 c, 7.5frame/s, ? 2 symbol min. typ. max. unit remarks ? 1 after closing the mechanical shutter, the smear can be reduced to below the detection limit by performing vertical register sweep operation. ? 2 excludes vertical dark signal shading caused by vertical register high-speed transfer. measurement method
10 ICX224AKF color coding of this image sensor & composition of luminance (y) and chroma (color difference) signals the complementary color filters of this image sensor are arranged in the layout shown in the figure on the left. for frame readout, the a1 and a2 lines are output as signals in the a field, and the b1 and b2 lines in the b field. horizontal register ye g ye g cy mg cy mg ye g ye g cy mg cy mg color coding diagram image sensor characteristics measurement method measurement conditions 1) in the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions, and the frame readout mode is used. 2) in the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (ob) is used as the reference for the signal output, which is taken as the value of the g/ye channel signal output or the mg/cy channel signal output of the measurement system. b2 b1 a2 a1 these signals are processed to form the y signal and chroma (color difference) signal as follows. the approximation: y = {g + mg + ye + cy} 1/4 = 1/4 {2b + 3g + 2r} is used for the y signal, and the approximation: r y = {(mg + ye) (g + cy)} = {2r g} b y = {(mg + cy) (g + ye)} = {2b g} are used for the chroma (color difference) signal.
11 ICX224AKF readout modes the diagram below shows the output methods for the following two readout modes. ye g ye g g ye g cy mg cy mg mg cy mg 7 6 5 4 3 2 1 v out ye g cy mg 9 8 ye g ye g g ye g cy mg cy mg mg cy mg 7 6 5 4 3 2 1 v out ye g cy mg 9 8 g mg 7 6 5 4 3 2 1 v out 9 8 ye g ye g ye g cy mg cy m g cy mg ye g cy mg frame readout mode high frame rate readout mode 1st field 2nd field note) blacked out portions in the diagram indicate pixels which are not read out. output starts from the line 5 in high frame rate readout mode. 1. frame readout mode in this mode, all pixel signals are divided into two fields and output. all pixel signals are read out independently, making this mode suitable for high resolution image capturing. 2. high frame rate readout mode all effective area signals are output in 1/4 the period for frame readout mode by reading out two lines for every eight lines. the number of output lines is 309 lines. this readout mode emphasizes processing speed over vertical resolution.
12 ICX224AKF definition of standard imaging conditions 1) standard imaging condition i : use a pattern box (luminance: 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter and image at f5.6. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) standard imaging condition ii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. sensitivity set to standard imaging condition i . after selecting the electronic shutter mode with a shutter speed of 1/100s, measure the signal outputs (v g , v mg , v ye and v cy ) at the center of each g, mg, ye and cy channel screen, and substitute the values into the following formulas. v = (v g + v mg + v ye + v cy )/4 s = v [mv] 2. sensitivity comparison set to standard imaging condition ii . adjust the luminous intensity so that the average value of the g/mg/ye/cy channel signal output is 150mv, and then measure the mg signal output (s mg [mv]) and g signal output (s g [mv]), and the ye signal output (s ye [mv]) and cy signal output (s cy [mv]) at the center of the screen. substitute the values into the following formulas. r mgg = s mg /s g r yecy = s ye /s cy 3. saturation signal set to standard imaging condition ii . after adjusting the luminous intensity to 10 times the intensity with the average value of the g/mg/ye/cy channel signal output, 150mv, measure the minimum values of the g, mg, ye and cy signal outputs. 4. smear set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, first adjust the luminous intensity to 500 times the intensity with the average value of the g/mg/ye/cy channel signal output, 150mv. after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blankings, measure the maximum value (vsm [mv]) independent of the g, mg, ye and cy signal outputs, and substitute the values into the following formula. sm = 100 [%] (1/10v method conversion value) 100 30 1 500 vsm 150 1 10
13 ICX224AKF 5. video signal shading set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity so that the average value of the g/mg/ye/cy channel signal output is 150mv. then measure the maximum (vmax [mv]) and minimum (vmin [mv]) values of the g/mg/ye/cy channel signal output and substitute the values into the following formula. sh = (vmax vmin) /150 100 [%] 6. dark signal measure the average value of the signal output (vdt [mv]) with the device ambient temperature 60 c and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 7. dark signal shading after measuring 6, measure the maximum (vdmax [mv]) and minimum (vdmin [mv]) values of the dark signal output and substitute the values into the following formula. ? vdt = vdmax vdmin [mv] 8. lag adjust the g/mg/ye/cy channel signal output generated by strobe light to 150mv. after setting the strobe light so that it strobes with the following timing, measure the residual signal (vlag). substitute the value into the following formula. lag = (vlag/150) 100 [%] vd vlag (lag) g/mg/ye/cy channel signal output 150mv light strobe light timing output
14 ICX224AKF notes) substrate bias control 1. the saturation signal level decreases when exposure is performed using the mechanical shutter, so control the substrate bias. 2. a saturation signal level equivalent to that for continuous exposure can be assured by connecting a 4.7k ? grounding resistor to the ccd c sub pin. drive timing precautions 1. blooming occurs in modes (monitoring, etc.) that do not use the mechanical shutter, so do not ground the connected 4.7k ? resistor. 2. tf is slow, so the internally generated voltage v sub may not drop to a sufficiently low level if the substrate bias control signal is not set to high level 20ms before entering the exposure period and the 4.7k ? resistor connected to the c sub pin is not grounded. 3. the blooming signal generated during exposure in mechanical shutter mode is swept by providing one field or more of idle tran sfer through vertical register high-speed sweep transfer from the time the mechanical shutter closes until sensor readout is performed. however, note that the v l potential and the sub pin dc voltage sag at this time. ccd out cxd1267an cxd1267an 15v xsub xv2 xv1 xv3 xsg1a xsg2a xv4 h 2 h 1 rg xv3 xv1 7.5v 22/20v 22/16v 1/35v 22/16v xsg1b xsg2b 100k 0.1 3.3/16v 0.1 2200p 1m 0.1 3.3/20v 0.01 v 4 v 3a v 3b v 2 v 1a v 1b gnd v out h 2 v dd h 1 rg v l c sub sub gnd 22/20v 2sk1875 47 1.8k vr1 (4.7k) h 2 h 1 nc gnd 1 4 5 6 7 8 9 10 2 3 11 12 13 14 15 16 1 4 5 6 7 8 9 10 2 3 11 12 13 14 15 16 17 18 19 20 1 4 5 6 7 8 9 10 2 3 11 12 13 14 15 16 17 18 19 20 17 18 19 20 icx224 (bottom view) v sub cont. gnd mechanical shutter mode tr 2ms tf 10ms substrate bias control signal v sub cont. substrate bias sub pin voltage internally generated value v sub drive circuit
15 ICX224AKF output after frame readout vd v1a v1b v2 v3a v3b v4 sub trg mechanical shutter open close open v sub cont. ccd out act. high frame rate readout mode frame readout mode high frame rate readout mode b c d e a a output signal b output signal c output signal (odd) c output signal (even) d output signal e output signal exposure operation drive timing chart (vertical sequence) high frame rate readout mode frame readout mode/electronic shutter normal operation note) the b output signal contains a blooming component and should therefore not be used.
16 ICX224AKF vd hd v1a/v1b v2 v3a/v3b v4 sub trg mechanical shutter v sub cont. ccd out exposure period all pixel output period open close "c" "a" "c" "b" 1 2 3 10 23 26 30 35 645 650 660 673 675 680 685 1300 1 2 3 open 1 3 5 7 9 1 3 5 7 9 11 1229 1231 1233 1235 2 4 6 8 10 2 4 6 8 10 12 1230 1232 1234 1236 drive timing chart (vertical sync) frame readout mode
17 ICX224AKF "a" enlarged "b" enlarged h1 v1a/v1b v2 v3a/v3b v4 v1a/v1b v2 v3a/v3b v4 1848 1 56 188 72 120 104 152 1027 1071 1091 1071 1029 136 88 200 184 168 216 1133 1131 1175 1848 120 1 56 188 104 152 136 88 168 drive timing chart (vertical sync) frame readout mode
18 ICX224AKF hd v1a v2 v3a v4 1 56 v3b v1b 14 14 14 14 #1 14 14 14 14 14 14 14 14 14 14 14 14 #2 #3 #4 14 14 14 #758 14 42504 bits = 23 lines 56 "c" enlarged drive timing chart (vertical sync) frame readout mode
19 ICX224AKF vd hd v1a v1b v2 v3a v3b v4 ccd out 320 325 1 2 3 4 5 10 15 18 20 325 1 10 15 18 20 1218 1223 1226 1231 1234 4 9 2 7 10 15 18 23 26 31 1218 1223 1226 1231 1234 4 9 2 7 10 15 18 23 26 31 "d" "d" drive timing chart (vertical sync) high frame rate readout mode
20 ICX224AKF "d" enlarged h1 v1a v1b v2 v3a v3b v4 1848 1 56 188 88 120 72 104 136 168 1027 1071 1091 1091 1133 1131 1175 1071 1071 1029 1111 88 120 104 136 168 1848 1 56 188 152 152 drive timing chart (vertical sync) high frame rate readout mode
21 ICX224AKF clk rg shp shd v1a v1b v2 v3a v3b v4 h1 h2 sub 1848 1 1 56 56 1 188 132 1 216 28 1 221 1 229 1 1 1 1 1 1 16 16 1 1 1 1 48 48 48 1 48 1 1 1 80 80 1 80 1 1 32 1 32 64 136 20 52 52 36 68 68 drive timing chart (horizontal sync) frame readout mode
22 ICX224AKF clk rg shp shd v1a v1b v2 v3a v3b v4 h1 h2 sub 1848 1 1 56 56 1 188 126 1 216 28 1 221 1 229 1 1 1 1 1 1 1 1 1 1 32 32 32 32 16 32 1 1 1 1 32 32 1 32 32 1 16 1 32 64 136 20 36 36 20 36 36 32 1 32 32 132 1 1 1 1 32 32 32 32 32 1 1 11 1 drive timing chart (horizontal sync) high frame rate readout mode
23 ICX224AKF notes on handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensors. e) for the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) soldering a) make sure the package temperature does not exceed 80 c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a ground 30w soldering iron and solder each pin in less than 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an image sensor, do not use a solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero-cross on/off type and connect it to ground. 3) dust and dirt protection image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. clean glass plates with the following operations as required, and use them. a) perform all assembly operations in a clean room (class 1000 or less). b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) when a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. do not reuse the tape. 4) installing (attaching) a) remain within the following limits when applying a static load to the package. do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (this may cause cracks in the package.) b) if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. compressive strength 50n aaaa aaaa cover glass plastic package 50n aaaa aaaa 1.2nm aaaa aaaa torsional strength
24 ICX224AKF c) the adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) the notch of the package is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch of the package. e) if the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) acrylate anaerobic adhesives are generally used to attach ccd image sensors. in addition, cyano- acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) others a) do not expose to strong light (sun rays) for long periods, as color filters will be discolored. when high luminous objects are imaged with the exposure level controlled by the electronic iris, the luminance of the image-plane may become excessive and discoloring of the color filter will possibly be accelerated. in such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power- off mode should be properly arranged. for continuous using under cruel condition exceeding the normal using condition, consult our company. b) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. c) brown stains may be seen on the bottom or side of the package. but this does not affect the ccd characteristics. d) this package has 2 kinds of internal structure. however, their package outline, optical size, and strength are the same. aaa structure a structure b chip metal plate (lead frame) package cross section of lead frame the cross section of lead frame can be seen on the side of the package for structure a.
25 ICX224AKF package structure package material lead treatment lead material package mass drawing number 20 pin sop plastic gold plating 42 alloy as-b7-02(e) 0.95g b 0.5 2.5 9.0 2.5 0.8 a 1 10 11 20 1 10 11 c b' 20 h v d 0.3 1.27 10.0 2.5 1.7 0.8 2.4 0.5 10.9 12.7 6.0 6.9 1.7 1.7 14.0 0.15 (0.6) 1.7 1.0 0.1 m ~ ~ ~ 13.8 0.1 12.0 0.1 2.9 0.15 0? to 10? 0.25 0.15 0.3 1. ?? is the center of the effective image area. 2. the two points ? of the package are the horizontal reference. the point ?' of the package is the vertical reference. 3. the bottom ? of the package, and the top of the cover glass ? are the height reference. 4. the center of the effective image area relative to ? and ?' is (h, v) = (6.9, 6.0) 0.07mm. 5. the rotation angle of the effective image area relative to h and v is 0.7?. 6. the height from the bottom ? to the effective image area is 1.41 0.10mm. the height from the top of the cover glass ?? to the effective image area is 1.49 0.15mm. 7. the tilt of the effective image area relative to the bottom ? is less than 50 m. the tilt of the effective image area relative to the top ?? of the cover glass is less than 50 m. 8. the thickness of the cover glass is 0.5mm, and the refractive index is 1.5. 9. the notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. package outline unit: mm sony corporation

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